Intel and SoftBank Plan to Launch New Memory Alternative to HBM by 2029

• February 3, 2026

Intel, in partnership with SoftBank, is preparing to develop a new type of memory technology intended to serve as an alternative to the widely used High Bandwidth Memory (HBM). This initiative aims to establish mass production of the new memory variant, known as ZAM, by the year 2029.

HBM has been recognized for its high performance in various computing applications, particularly in graphics and AI workloads. However, despite its demand, HBM presents several challenges. It is known for its high cost and power consumption, which limits its scalability and practical use cases. Moreover, the increasing focus on expanding HBM production has impacted the availability and manufacturing capacity of traditional DRAM, a staple memory technology across the computing industry.

Addressing Current Memory Challenges

The collaboration between Intel and SoftBank seeks to provide an alternative solution that could potentially alleviate the pressure on DRAM production lines while offering a memory technology that balances cost, power efficiency, and performance more effectively than existing HBM options.

While specific technical details about ZAM have not yet been disclosed, the project reflects a broader industry trend toward diversifying memory technologies to meet evolving computational demands. With the increasing complexity of AI models and high-performance computing tasks, there is a sustained need for memory solutions that can deliver greater bandwidth without proportionally increasing power use or cost.

Intel’s experience in semiconductor manufacturing, combined with SoftBank’s investment capabilities and strategic vision in technology, positions this partnership well to potentially reshape future memory landscapes. By targeting 2029 for producing this new memory type, the companies signal a long-term commitment to innovation in this critical segment of the hardware ecosystem.

As the semiconductor sector grapples with balancing innovation and manufacturing constraints, the success of projects like ZAM could influence memory supply chains and the design of next-generation computing platforms.

Further information regarding the performance characteristics, market strategy, and integration plans for ZAM memory will be awaited as the development progresses in the coming years.

Intel and SoftBank aim to introduce a novel memory technology as an alternative to HBM, targeting production by 2029.