Chinese Chipmakers Urge Government to Establish Domestic Lithography Industry by 2030

• March 7, 2026

Senior executives from China’s semiconductor sector have made a public appeal for the government to coordinate efforts aimed at developing domestic lithography technology. Their call emphasizes the need for comprehensive national projects scheduled between 2026 and 2030, focusing on the creation of advanced lithography systems within the country.

Lithography technology is central to semiconductor manufacturing, enabling the production of highly detailed microchips used across modern electronics. Currently, the global supply chain heavily relies on specialized companies, including the Dutch firm ASML, which dominates the production of extreme ultraviolet (EUV) lithography equipment. China’s semiconductor industry faces challenges in accessing and developing comparable technology, which has led to growing calls for increased technological autonomy.

Towards a Domestic Lithography Capability

China’s push to establish its own lithography technology aligns with broader strategic goals to reduce dependency on foreign suppliers and enhance the resilience of its semiconductor ecosystem. Industry leaders are urging government authorities to integrate and prioritize multiple national initiatives in a concerted effort that spans the next five years. This approach is aimed at accelerating research, development, and industrialization of lithography equipment that can meet domestic market needs.

The ambition to create a ‘Chinese ASML’ reflects both the strategic importance of lithography technology and the recognition that mastering these complex systems is critical for the future competitiveness of the Chinese semiconductor industry. Developing such advanced manufacturing tools domestically would strengthen China’s position in the global supply chain and support its broader goals of technological self-sufficiency.

While specific details regarding funding, implementation, or technical milestones were not disclosed, the unified call from top semiconductor executives indicates a growing consensus within the industry. The coordination of national projects could potentially involve collaborations across research institutions, manufacturing enterprises, and government bodies to pool resources and expertise.

The semiconductor landscape is marked by rapid technological progress and intense geopolitical competition. For China, advancing lithography capabilities represents a key element in its strategy to elevate its semiconductor design and production ecosystems to more advanced levels. Achieving this would diminish vulnerabilities arising from reliance on external technology providers, particularly amid ongoing international trade uncertainties.

As the 2026 to 2030 time frame approaches, the semiconductor community within China will likely focus intensely on innovation in lithographic equipment. Success in this venture would not only influence the domestic chipmaking industry but could also reshape competitive dynamics internationally by introducing a new player capable of challenging established equipment manufacturers.

Overall, the call to action from Chinese semiconductor leaders underscores the critical role lithography will continue to play in shaping the future of chip production technology, with national coordination viewed as essential to realizing this ambition.

Chinese semiconductor leaders call for coordinated national projects to develop domestic lithography systems and boost technological independence by 2030.