JEDEC Unveils LPDDR6 with Up to 512GB Capacity and New SOCAMM2 and PIM Standards for Data Centers

• April 23, 2026

JEDEC Solid State Technology Association has announced its plans to advance the LPDDR6 memory standard, introducing modules with densities reaching as high as 512 gigabytes. This move is designed to extend the applicability of LPDDR6 beyond traditional mobile devices, targeting high-performance data center operations and artificial intelligence computing tasks.

Next-Generation Memory and Computing Standards

Alongside the update to LPDDR6, JEDEC revealed developments for two additional memory-related standards currently in the works: SOCAMM2 and PIM. These new specifications aim to address emerging requirements in modular memory systems and in-memory processing for data centers.

SOCAMM2 is positioned as an evolution in modular memory design, potentially improving scalability and integration for servers operating in dense data center environments. The standard builds upon concepts of system-on-chip-attached memory modules, offering enhanced flexibility for complex computing infrastructures.

In parallel, the Processing-In-Memory (PIM) standard under development is focused on enabling computational capabilities directly within the memory layer. This approach is intended to reduce latency and improve efficiency for AI workloads and other data-intensive applications by minimizing the need for data movement between memory and processors.

The expansion of LPDDR6 memory density to 512GB per module represents a significant leap from previous generations, reflecting growing demands for large-capacity, high-bandwidth memory in next-generation servers. This advancement also demonstrates the ongoing industry effort to leverage low-power DDR technology within data center environments, where energy efficiency is as crucial as performance.

JEDEC’s announcements highlight a broader trend toward integrating more sophisticated memory solutions that support evolving computing paradigms. By addressing modularity through SOCAMM2 and computation via PIM, the memory ecosystem is poised to accommodate the increasing complexity and scale of artificial intelligence and cloud computing infrastructures.

Specific timelines, pricing, and further technical details for LPDDR6, SOCAMM2, and PIM standards have yet to be disclosed, but their introduction signals a continued focus on memory innovation to meet growing data center and AI application demands.

JEDEC introduces LPDDR6 with modules up to 512GB and announces two new standards, SOCAMM2 and PIM, aimed at data center and AI workloads.