Tag: chip packaging

TSMC will add two new chip packaging plants in southern Taiwan to meet growing AI infrastructure chip testing and packaging needs.

Despite efforts to boost domestic semiconductor manufacturing, the US remains heavily reliant on TSMC for cutting-edge chip packaging technology.

Intel appoints former SK hynix head as Executive VP to enhance chip packaging and foundry technology development.

MediaTek now allows its chip customers to leverage packaging services from both TSMC and Intel, broadening its manufacturing capabilities.

TSMC is shifting focus to develop truly integrated silicon photonics, aiming to redefine semiconductor manufacturing and chip packaging.

Intel seeks to secure billion-dollar chip packaging deals with Google and Amazon at its New Mexico facilities.

TSMC aims to grow its Arizona operations to 12 factories, add advanced chip packaging plants, and establish a new research center.

Intel is reportedly gearing up its Malaysian facilities and EMIB tech to handle packaging for Nvidia’s upcoming Feynman AI processors.

ASML plans to extend its offerings beyond EUV lithography by adding cutting-edge chip assembly and packaging solutions.

Intel reveals a groundbreaking AI chip prototype with four logical units and a dozen HBM4 stacks, showcasing its hardware packaging expertise.

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