Tag: chip packaging
MediaTek Expands Packaging Options with Intel’s Advanced Services
MediaTek now allows its chip customers to leverage packaging services from both TSMC and Intel, broadening its manufacturing capabilities.
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TSMC Advances Toward Fully Integrated Silicon Photonics
TSMC is shifting focus to develop truly integrated silicon photonics, aiming to redefine semiconductor manufacturing and chip packaging.
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Intel Targets Major Chip Packaging Contracts with Google and Amazon
Intel seeks to secure billion-dollar chip packaging deals with Google and Amazon at its New Mexico facilities.
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TSMC Plans Major Expansion of Semiconductor Facilities in Arizona
TSMC aims to grow its Arizona operations to 12 factories, add advanced chip packaging plants, and establish a new research center.
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Intel Prepares Production Capacity for Nvidia’s Next-Gen AI Chips
Intel is reportedly gearing up its Malaysian facilities and EMIB tech to handle packaging for Nvidia’s upcoming Feynman AI processors.
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ASML to Broaden Product Range with Advanced Chip Packaging Equipment
ASML plans to extend its offerings beyond EUV lithography by adding cutting-edge chip assembly and packaging solutions.
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Intel Unveils Massive AI Chip Prototype Featuring Four Logical Blocks and 12 HBM4 Memory Stacks
Intel reveals a groundbreaking AI chip prototype with four logical units and a dozen HBM4 stacks, showcasing its hardware packaging expertise.
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