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Lenovo Unveils ThinkBook Modular AI PC Concept with Dual Displays and Detachable Keyboard
Lenovo introduces the ThinkBook Modular AI PC, a flexible modular laptop concept featuring dual screens and a detachable keyboard aimed at business professionals.
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Broadcom Aims to Challenge Nvidia with Ambitious 3D Chip Production Goal by 2027
Broadcom targets production of one million 3D stacked chips by 2027, positioning itself as a strong competitor to Nvidia in AI hardware.
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Xiaomi Unveils Five New Electric Scooters in the Electric Scooter 6 Series
Xiaomi introduces the Electric Scooter 6 lineup featuring five models suited for varied budgets and riding needs, offering up to 75 km range.
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Evaluating 16GB DDR5 Memory Configurations on Ryzen Zen 4 and Zen 5 CPUs
Comparing 16GB DDR5 RAM setups on Ryzen Zen 4 and Zen 5 processors reveals performance trade-offs between dual-channel and single-channel configurations.
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Honor to Launch Robot Phone with Humanoid Features in Second Half of 2026
Honor revealed a working prototype of its Robot Phone at MWC 2026, confirming a release later this year with humanoid robot capabilities.
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Lenovo Launches ThinkBook 16+ with Cutting-Edge LPDDR5X Memory and Intel Core Ultra 300
Lenovo introduces the ThinkBook 16+, its first mass-market laptop featuring LPDDR5X memory at 8533 MT/s and powered by Intel Core Ultra 300 processor.
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Honor Unveils Its First Humanoid Robot Featuring Dance Moves and Backflips at MWC 2026
At MWC 2026, Honor introduced its inaugural humanoid robot capable of performing backflips, dancing, and engaging with the audience.
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Developer Recreates 1994 Debian Linux with GUI Accessible via Web Browser
A developer launched an open-source project delivering a 1994 Debian Linux experience with graphical interface directly in a web browser.
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Samsung Limits Access to Advanced Recovery Tools in Galaxy Smartphones with One UI 8.5 Beta Update
Samsung’s One UI 8.5 beta update reduces recovery menu options, impacting experienced Galaxy users and enthusiasts seeking advanced device controls.
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Honor Unveils Ultra-Thin Magic V6 Foldable Smartphone with Snapdragon 8 Elite Gen 5
Honor introduces the Magic V6, a foldable smartphone featuring an ultra-thin 4mm design, Snapdragon 8 Elite Gen 5 chipset, and a large battery.
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Samsung and SK Hynix Plan Memory Price Increase Amid Strong Demand in Q2
Samsung and SK Hynix notify clients about rising memory prices for Q2 as demand for DRAM remains robust according to industry sources.
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Honor Unveils MagicBook Pro 14 2026 with 14.6-Inch 3.1K OLED Display and Intel Panther Lake-H Chips
Honor introduces the MagicBook Pro 14 2026 featuring a 14.6-inch 3.1K OLED touchscreen and Intel Panther Lake-H processors.
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