Tag: foundry
TSMC Increases Prices for Advanced Semiconductor Manufacturing Processes
TSMC announced a price hike on advanced semiconductor manufacturing processes, impacting a significant share of its revenue.
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TSMC Accelerates Shift Away from Mature Technologies to Focus on Advanced Node Production
TSMC significantly reduces 28nm chip production as it moves to advanced nodes at 7nm and below, now generating nearly 75% of revenue from these processes.
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Intel Hires Former SK Hynix Leader as Executive VP to Advance Foundry Operations
Intel appoints former SK hynix head as Executive VP to enhance chip packaging and foundry technology development.
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Intel Begins Pilot Production of 18A-P Chip Technology to Boost Foundry Services
Intel initiates pilot manufacturing of chips using its new 18A-P technology, aiming to attract external customers for semiconductor production.
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Samsung Foundry Anticipated to Reach Profitability by Q3 2026 After Years of Losses
Samsung Foundry, facing losses since 2022, could achieve profitability in Q3 2026 amid improved chip manufacturing orders.
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TSMC Acquires High-NA EUV Lithography Equipment but Holds Off on Mass Production Use
TSMC has purchased High-NA EUV lithography machines but remains cautious about deploying them in large-scale chip manufacturing.
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AMD CEO Travels to Taiwan to Secure Additional Chip Production Capacity from TSMC
AMD’s CEO visited Taiwan to negotiate increased chip production capacity with TSMC amid growing dependency on the foundry.
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Intel Reports Improvement in Yield Rates Across Intel 4, 3, and 18A Process Nodes
Intel’s foundry division shows improved chip yield rates for Intel 4, 3, and 18A processes despite ongoing operational losses.
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Samsung Boosts Yield of 2nm Chips, Closing the Gap with TSMC
Samsung raises yield on its 2-nanometer semiconductor process above 60%, significantly cutting costs and expanding contract manufacturing capacity.
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TSMC’s 2-Nanometer Chip Production Fully Booked Through 2028
TSMC’s cutting-edge 2nm chip production capacity is fully booked for the next two years, with earliest deliveries expected by mid-2027.
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Intel Unveils Massive AI Chip Prototype Featuring Four Logical Blocks and 12 HBM4 Memory Stacks
Intel reveals a groundbreaking AI chip prototype with four logical units and a dozen HBM4 stacks, showcasing its hardware packaging expertise.
Read MoreIntel Pauses Mass Deployment of 14A Process Until Customer Demand Grows
Intel delays large-scale rollout of its 14A semiconductor process, waiting for sufficient customer demand before scaling production.
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