Tag: high-performance-computing
ASUS Unveils RS720A-E13-RS8G: A High-Performance Dual AMD EPYC Server with PCIe 5.0
ASUS introduces the RS720A-E13-RS8G, a versatile 2U server featuring dual AMD EPYC Turin processors, multiple GPUs, PCIe 5.0, and advanced storage capabilities.
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AMD Instinct MI430X Accelerator Delivers Sixfold Performance Boost Over Nvidia Rubin in HPC Tasks
AMD unveils Instinct MI430X accelerator achieving six times Nvidia Rubin’s speed, targeting high-performance computing over AI workloads.
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Anthropic Partners with SpaceX to Utilize Colossus 1 Data Center Resources
Anthropic gains full access to SpaceX’s Colossus 1 data center as both companies explore large-scale computing systems in space.
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Nvidia Launches DGX Station Powered by GB300 Grace Blackwell with Massive LPDDR5X Memory
Nvidia unveils the DGX Station featuring GB300 Grace Blackwell and nearly 0.5TB of LPDDR5X, targeting AI developers and data scientists.
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IBM and RIKEN Achieve Seamless Integration of Supercomputer and Quantum Processor in Japan
IBM and Japan’s RIKEN institute have created the first continuous data exchange loop between a supercomputer and a quantum processor.
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iRU Unveils Rock G2212IG6 Server Tailored for AI and HPC Workloads
iRU launches the Rock G2212IG6 server, designed for AI and HPC, featuring Intel Xeon 6 platform with PCIe 5.0 support and extensive expansion options.
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Sberbank to Invest 500 Billion Rubles in New Supercomputer for AI and HPC
Sberbank plans to allocate at least 500 billion rubles to develop its third supercomputer for AI and high-performance computing applications.
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AMD Threadripper Pro 9995WX Overclocked to 5.3 GHz Using Advanced Liquid Cooling Setup
A 96-core AMD Threadripper Pro 9995WX was pushed to 5.3 GHz with a custom liquid cooling system featuring a CNC-machined waterblock and industrial chiller.
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Intel Unveils Massive AI Chip Prototype Featuring Four Logical Blocks and 12 HBM4 Memory Stacks
Intel reveals a groundbreaking AI chip prototype with four logical units and a dozen HBM4 stacks, showcasing its hardware packaging expertise.
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Intel Unveils Glass Substrate for Advanced AI and HPC Chips
Intel introduced a novel glass substrate technology to enhance chip manufacturing for AI accelerators and high-performance computing.
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