AMD and Samsung Deepen Collaboration on HBM4 Memory for AI Accelerators

• March 18, 2026

AMD has formally extended its partnership with Samsung Electronics to further develop HBM4 memory technology aimed at AI accelerators. The updated collaboration was announced this week following a signing ceremony held in Pyeongtaek, South Korea, the location of one of Samsung’s major memory chip fabrication facilities.

The relationship between AMD and Samsung has been under close watch since rumors surfaced regarding AMD CEO Lisa Su’s visit to South Korea for negotiations. The official press release from AMD confirms that the two companies have agreed to a new memorandum of understanding to deepen their work on next-generation High Bandwidth Memory.

Strengthening the Supply Chain for AI Compute

High Bandwidth Memory (HBM) is a crucial element in modern AI hardware, providing rapid data movement between processors and memory. The HBM4 standard, the latest in this evolution, offers improvements designed to meet the increasing demands of AI workloads, including higher bandwidth and efficiency. By collaborating closely, AMD and Samsung aim to integrate this cutting-edge memory solution into AI accelerators that power applications ranging from deep learning to data analytics.

Samsung’s advanced semiconductor manufacturing capability plays a pivotal role in meeting the performance and volume requirements for HBM4 chips. The company operates one of the world’s largest memory production complexes in Pyeongtaek, ensuring that the supply chain for these essential components remains robust and scalable.

While specific technical details and timelines have not been disclosed, this enhanced partnership signals a shared commitment between AMD and Samsung to drive innovation in AI hardware. The co-development effort is aligned with the broader industry push to build more efficient and powerful AI accelerators, critical for expanding the reach of artificial intelligence technologies across numerous sectors.

This renewed cooperation also underscores the importance of cross-industry alliances in addressing the growing complexities of semiconductor development. As AI workloads become more demanding, memory innovations such as HBM4 are instrumental in overcoming bottlenecks and unlocking higher computational performance.

Overall, the latest agreement between AMD and Samsung is a significant step toward advancing the underlying hardware that supports the AI revolution. Both companies are positioned to leverage their technological expertise and manufacturing strengths to accelerate the deployment of next-generation memory solutions in AI accelerator architectures.

AMD and Samsung have signed a new memorandum to advance their joint development of HBM4 memory technology for AI accelerator applications.