Tag: chip manufacturing
TSMC Credits Nvidia Technology for Enhancing Chip Production Efficiency
TSMC reveals that Nvidia’s technologies have enabled it to improve the quality and speed of its chip manufacturing processes.
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Nvidia CEO Commends Huawei’s Breakthrough in Chip Manufacturing Technology
Nvidia’s CEO praised Huawei for advancing chip production methods that rival foreign competitors without major lithography improvements.
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TSMC Begins Hiring for New Chip Manufacturing Plant in Dresden
TSMC has initiated recruitment for its new chip fabrication facility in Dresden, marking the company’s expanding footprint in Europe.
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New 3D Chip Manufacturing Technique in the US Achieves Record Density Beyond Current Semiconductors
Researchers in the US demonstrated a novel 3D chip stacking method that surpasses today’s semiconductor density limits while overcoming thermal constraints.
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MediaTek Expands Packaging Options with Intel’s Advanced Services
MediaTek now allows its chip customers to leverage packaging services from both TSMC and Intel, broadening its manufacturing capabilities.
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Applied Materials to Double Manufacturing Capacity Amid Chip Equipment Demand Surge
Applied Materials plans to double production capacity to meet growing demand for chipmaking equipment fueled by the AI boom.
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Exploring the Future of High-NA EUV Photolithography Beyond Current Limits
High-NA EUV photolithography at 13.5 nm currently leads semiconductor manufacturing but faces challenges in further miniaturization.
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TSMC Increases Employee Bonuses by Over 30% Following Workforce Unrest
TSMC has raised employee bonuses by more than 30% amid labor tensions, ahead of union negotiations seen at Samsung Electronics.
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TSMC to Raise 3nm Chip Prices Amid Soaring AI-Driven Demand
TSMC plans significant price hikes for 3nm chips due to increased demand driven by AI applications and cloud service providers.
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Samsung Unveils World’s First 900-Layer 3D NAND Flash Chip Prototype
Samsung has developed the first-ever 3D NAND flash chip prototype featuring 900 layers, aiming to lead the memory chip industry.
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Huawei Aims to Match Western 1.4-Nanometer Chips by 2031 with New Signal Timing Optimization Approach
At ISCAS 2026 in Shanghai, Huawei reveals plans to surpass Moore’s Law limits by focusing on signal transmission timing to enhance chip performance.
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Samsung Electronics Chairman Holds Confidential Talks with MediaTek on Semiconductor Supply Chain Collaboration
Samsung’s chairman met with MediaTek executives in Taiwan to discuss strengthening semiconductor supply chains and expanding partnership opportunities.
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