Tag: microelectronics
New 3D Chip Manufacturing Technique in the US Achieves Record Density Beyond Current Semiconductors
Researchers in the US demonstrated a novel 3D chip stacking method that surpasses today’s semiconductor density limits while overcoming thermal constraints.
Read MoreRussian Microelectronics Manufacturer Element Reports Significant Loss in 2025
Russian microelectronics producer Element faced a 2 billion ruble loss in 2025 due to a sharp decline in industrial demand.
Read MoreIntel Develops World’s Thinnest Gallium Nitride Chiplets for Silicon Integration
Intel has advanced chip technology by creating ultra-thin gallium nitride chiplets that can be integrated directly onto silicon chips.
Read MoreNew Visualization Tool Uncovers Atomic Defects in Nanometer-Scale Transistors
Cornell and industry partners developed a breakthrough method to detect atomic-level defects in advanced semiconductor devices.
Read MoreIntel Unveils Glass Substrate for Advanced AI and HPC Chips
Intel introduced a novel glass substrate technology to enhance chip manufacturing for AI accelerators and high-performance computing.
Read MoreRecent Posts
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- Researchers Develop First Silicon Spintronic Chip for Probabilistic AI Computing
- Corsair Unveils HX1000i Shift Crystal with Transparent Design at Computex 2026
- AI in May 2026: Effective Yet Imperfect in Real-World Applications
- Microsoft Surface Laptop Ultra Features Unconventionally Large USB-C Port